Part Number | LPC2470FET208,551 |
---|---|
Manufacturer | NXP |
Quantity in stock | 169700 Pieces |
Market Price | - |
Our Better Price | Send by email: [email protected] |
Delivery Time | 1 day (can ship today) |
Description | MCU 16-bit 32-bit LPC2000 ARM7TDMI-S RISC ROMLess 3.3V 208-Pin TFBGA Tray |
Category | Microcontrollers MCU IC |
Family | ARM Based Microcontrollers MCU |
ROHS Compliant | Yes |
MSL Level | LPC2470FET208,551 |
Datasheet download | LPC2470FET208,551.pdf |
Part Number | LPC2470FET208,551 |
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Operating Supply Voltage | 3.3 V |
Supplier Package | TFBGA |
Maximum Speed | 72 MHz |
Lead Finish | Tin/Silver/Copper |
Program Memory Type | ROMLess |
RAM Size | 98 KB |
Instruction Set Architecture | RISC |
Rad Hard | No |
Operating Temperature | -40 to 85 °C |
Max Processing Temp | 260 |
Maximum Expanded Memory Size | 4 GB |
MSL Level | 2 |
Maximum Operating Supply Voltage | 3.6 V |
Product Dimensions | 15.1 x 15.1 x 0.8 mm |
Minimum Operating Supply Voltage | 3 V |
Number of Programmable I/Os | 160 |
Maximum Power Dissipation | 1500 mW |
Mounting | Surface Mount |
Screening Level | Industrial |
Interface Type | CAN/I2C/I2S/SPI/SSP/UART/USB |
On-Chip ADC | 8-chx10-bit |
Data Bus Width | 16|32 Bit |
Number of Timers | 4 |
Pin Count | 208 |
Device Core | ARM7TDMI-S |
Package | 208TFBGA |
Replacement Part Number | PART-LPC2470FET208,551 |
Weight | Contact us |
Country of Origin | - |
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